
Networking &
Communications
Networking & Communications
Supports 100G–1.6T high-speed transmission, specially built for base stations, switches and wireless devices to ensure low-loss, high-reliability communication connections.
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Key Processes
- High-Frequency/High-Speed Material
- Back drilling
- Skip via
- Impedance control
- Insertion loss
- High-layer count
- High aspect ratio
- Fine circuitry
- Layer-to-layer alignment
- PCIe 6.0
- HVLP copper foil
- CLL hybrid lamination
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Product Applications
- Switch
- SSD
- PCLE card
- Base station
Core Capabilities
| Project | Capabilities |
|---|---|
| Max. layer count | 36 |
| Materials | Ultra low loss Ⅲ,High-frequency materials |
| Max. aspect ratio | 30:1 |
| Line/space tolerance | ±20%; ±10% for specially controlled signal lines |
| Layer-to-layer registration accuracy | 4mil |
| Back drill stub length | 2-8mil |
| Insertion loss | Delta L |
| Impedance tolerance | ±8% |





