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Servers &
Data Centers

Servers & Data Centers

Compatible with data center server and AI server platforms, featuring high-layer-count and high-reliability designs to meet stringent data center performance requirements.
  • Servers & Data Centers
  • Servers & Data Centers
  • Key Processes
    High-speed material application
    Back drilling
    Skip via
    Advanced HDI
    Impedance control
    Insertion loss
    High-layer count
    High-density fine circuitry
    Layer-to-layer alignment
    Gold fingers
    PCIe 6.0
    N+N/N+M+N
    Hybrid lamination
  • Product Applications
    AI acceleration cards
    Server
    Computer Try
    UBB
    OAM
    Module
    Purley
    Whitley
    EGS
    Birch
    OAK

Core Capabilities

Project Capabilities
Max. layer count 48
Materials Very low loss、Ultra low loss
Process Advanced HDI
Max. aspect ratio 30:1
Line/space tolerance ±20%; ±10% for specially controlled signal lines
Layer-to-layer registration accuracy 4 mil
Back drill stub length 2-6mil
Insertion Loss Delta L / VNA
Impedance Tolerance ±8%