Connecting Global PCB Industry Partners for High-End Manufacturing and Future Collaboration | Sundell Hosts HDP 2026 Asia Member Meeting

  • 04 Jun 2026

On June 3, 2026, the HDP 2026 Asia Member Meeting, hosted by Sundell Technology Co., Ltd., officially opened in Nonthaburi, Thailand. The meeting brought together representatives from the global PCB industry for meaningful exchange on advanced PCB technologies, industry transformation and future collaboration.

 

 

The meeting focused on advanced PCB technologies, high-frequency and high-speed applications, and reliability. As the Host of this year's Asia Member Meeting, Sundell was honored to provide an open platform for industry dialogue and to join partners in exploring the future direction of the PCB industry amid a new wave of technology evolution.

During the opening session, Sundell's Vice President Fred Hickman briefly shared the company's perspective on industry trends. With the rapid development of artificial intelligence, smart mobility and high-speed communications, printed circuit boards, as a critical hardware foundation of modern technology, are facing higher requirements for precision, reliability and manufacturing capability. In response to both the opportunities and challenges brought by industry transformation, global collaboration, resource sharing and collaborative innovation will become increasingly important for the long-term sustainable development of the industry.

Following the meeting sessions, more than 40 representatives from THPCA, HDP and PCB value chain companies were invited to visit Sundell's manufacturing facility. Through the on-site tour, guests gained a closer look at Sundell's production capabilities and technical strengths in AI computing PCBs, advanced HDI and high-speed interconnect applications. The guests also spoke highly of Sundell's comprehensive strengths in high-end PCB manufacturing, intelligent production, quality control and ESG-driven sustainable development.

From conference dialogue to factory visits, the event connected forward-looking industry topics with real manufacturing scenarios. It also created valuable opportunities for deeper communication, collaborative innovation and future cooperation across the upstream and downstream PCB value chain.

We sincerely thanks HDP, THPCA and all participating industry partners for their support and engagement. Looking ahead, Sundell will continue to uphold the values of openness, collaboration, innovation and sustainable development, working together with global customers, technology partners, industry organizations and value chain partners to advance the high-end PCB industry toward a more reliable, efficient and greener future.